| \? P3ooA, P300B, P300D, P3ooG, P300J, P3ooK, P300K7 Www'ViShay'C°m Vishay General Semiconductor THERMAL cHARAcTERls cs (TA 25 00 unless otherwise noted) PARAMETER Typical thermal resistance N atell) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5 mm) lead length, PCB mounted with 0.8“ x 0.8"(20 mm x 20 mm) copper heatsinks ORDER no INFORMAT on (Example) m:1 100 L : D 375“ (9.5 mm) ‘4 Lead Lengtn 3 Pulse Width : 300 us1 % Duty cycle I“ :1 D E“ x 0.5“ x 0.04“(20 mm X20 mm XI mm)Copper Heat Slnks ‘:1 0.1 instantaneous Fonivard Current (A) Average Forward Rectitied Current (A) Number of Cycles at 60 HZ Percent of Rated Peak Reverse Voltage (%) n 0.01 20 50 100 150 Ian 04 Us 06 1.0 1.2 1.4 1.6 1.5 Ambient Temperature (“C) Instantaneous Forward Voltage (V)Fig. 1 - Forward Current Derating Cun/e Fig. 3 - Typical Instantaneous Forward Characteristics mun j—_ 100 S 100 01 Peak Forward Surge Current (A) instantaneous Reverse Current (DA) Fig. 2 - Max. Peak Forward Surge Current Fig. 4 - Typical Reverse Characteristics Revision: 13-Aug-13 2 Document Number: 88691 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vIsnay.com/doc?91000 |